: supply a waveform which made from X B/D to panel and select
a output pin that is controlled by COF when be on or off.
96 output pin per IC.
─
the more the resolution higher, the less spare space where
can set IC on it in B/D. without using IC PACKAGE,
we can use a BARE IC , so we can get IC with LOW COST
─
because we do not solder IC on PCB directly,
a soldering defect rate decrease.
* composition
1) FPC + Heat /Sink
⇒
FPC for COF must have a Low Spec decline with getting damp
2) CHIP resistor + CHIP CAPACITOR
3) BARE IC (STV7610A/WAF) + GOLD WIRE/AL WIRE
4) EPOXY MOLDING
9. COF (Chip On Film)
Bare IC
* 42 V6 COF is the same as 42V5.
3. Basic
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